The equipment SB makes it possible to carry out easily, card repairs with the finest components

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Functions details

  • Make a transfer of solder cream on smaller housings
  • Intervene on any type of components such that: BGA, micro BGA, QFN, Flex


  • Fast intervention
  • Manual way
  • Easy to use
  • Secures the application of solder cream
  • Perfect maintenance of the component
  • Small footprint
  • Standalone station, easily transportable
  • Delivered in its carrying case
  • Financial accessibility