BGA package repair and reballing equipment

On-site repair of BGA and micro BGA packages has become essential. Even with rigorous quality control processes, production defects can occur. Being able to quickly and safely replace components on assembled boards reduces costs and avoids returns or production losses.

Our solutions?

• RB01: Bill or reball all types of BGAs and micro BGAs.
• SB03: Easily repair boards with the thinnest components.

STPConcept supports you to ensure reliable, fast, and cost-effective repairs directly on your production lines.